Electronic failure analysis · Highland, NY · since 1988
Failure analysis, electrical testing, process evaluation and testing to industry specifications. You send the failed part. You get a report that names the cause.
Recent success stories
Gideon received several Browning BTC-7-4K-Edge cameras from the field. The cameras were dead on arrival. The objective was to find the cause of failure. There was no external physical damage to any cameras The batteries were replaced with new ones. The camera …
Read the case →Gideon received six failed STMicroelectronics STW37N60DM2AG 600V MOSFETs for failure analysis. These high voltage N-channel Power MOSFET are part of the MDmesh™ DM2 fast recovery diode series. They offer a very low recovery charge (Qrr) and time (trr) combined …
Read the case →1 Circuit Analysis 1.1 Device Failures and Circuit Description The failing units have repeatedly experienced failures of Vishay SQD50P04-13 power MOSFETs in locations Q14 and Q27. Device-level analysis performed by Gideon has indicated that the devices in …
Read the case →Analytical services
Each technique answers a different question. We choose the set that fits the failure, not the other way round.
Surface topography to 250,000×, EDS elemental analysis and EBIC imaging of components, boards and materials.
Read about Scanning Electron Microscopy (SEM)
Nondestructive inspection of solder joints, voids, cracks, delamination and sealed packages.
Read about X-Ray Radiography
Identification of organic contamination, flux residues, polymers and extractables.
Read about Fourier Transform Infra-Red
Nondestructive elemental analysis of solids, powders and liquids, including plating and alloys.
Read about X-Ray Fluorescence Spectrometry (XRF)
Crystalline phase identification and structural analysis of polycrystalline materials.
Read about X-Ray Diffraction
TMA, DSC and TGA to characterize materials as a function of temperature.
Read about Thermal AnalysisPart numbers, how it was used, how it failed, and how many. Ship the parts to Highland, NY.
Electrical characterization first. Then radiography, cross-sections, SEM, FTIR or whatever the evidence calls for.
Micrographs, data and a plain conclusion: design, process, application, materials or wear-out.
Send a short description and we reply with a plan and a quote.
