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X-Ray Radiography Radiography is a nondestructive inspection method for examining electronics components, solder joints, cracks, voids, delamination and packaging inspection. Images are developed by the absorption of x-rays as the beam passes through the sample. Radiographic inspection depends on changes in density differences in the atomic number of the materials (metal is more dense than plastic, voids are air spaces, or as atomic number increases the materials becomes denser). For small-scale devices, radiographic techniques specified in MIL-STD-883 were sufficient. High-resolution microfocus x-ray sources and large-area have realtime capability. This allows the manipulation of the sample in 3D such that it can be inspected from all angels. The analysis of high-density, large-area hybrids requires this combination of higher resolution and image analysis capability. X-ray inspection allows the evaluation of assembly defects in locations where direct observation is impossible. Defects such as registration misalignment of multilayer substrates, solder voids in flip-chip mounting and higher-level package assembly, voids in die attach, and postseal inspection for such defects as wire bonding opens and shorts, size, and die component lifting are detected with x-ray radiographic analysis. x-ray image in which wire bonds are easily resolved and die attach defects are visible. Gideon Analytical Labs 80 Loughran Ln Highland NY 12528-2838 845-255-5356 info@gideonlabs.com |
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