BGA Failure

Gideon Analytical Laboratories received several ball grid arrays (BGAs) to specifically look for any shorts, opens, cracks, or contamination issues that were preventing its operation. Radiography analysis was requested. A BGA is a type of surface-mount packaging (a chip carrier) used for integrated circuits. They come in two basic types: plastic ball grid arrays (PBGAs) and ceramic ball grid arrays (CBGAs). BGA packages are used to permanently mount devices such as microprocessors.

Gideon Analytical Laboratories received one static transfer switch (STS) Main Logic printed circuit board (PCB) assembly with two chips onboard digital signal processor (DSP)’s that were non-functional. The thought was the DSPs may have ball grid array (BGA) solder joint integrity issues causing the failures. Analysis ensued. The three DSPs were removed from the PCB and immersed into the green dye and the DSP was pried from the main circuit board to reveal any cracked solder BGAs.